Ukupholisa Kokwenziwa Kokuthintana Naye: “Indlela Ezolile” Yezicelo Zebha Ye-Laser Diode Enamandla Aphezulu

Njengoba ubuchwepheshe be-laser obunamandla amakhulu buqhubeka buthuthuka ngokushesha, Ama-Laser Diode Bars (LDBs) asetshenziswe kabanzi ekucubunguleni izimboni, ukuhlinzwa kwezokwelapha, i-LiDAR, nocwaningo lwesayensi ngenxa yokuminyana kwamandla aphezulu kanye nokukhishwa kokukhanya okuphezulu. Kodwa-ke, ngokuhlanganiswa okukhulayo nokusebenza kwamanje kwama-laser chips, izinselele zokulawula ukushisa ziya zigqama kakhulu—okunomthelela oqondile ekuzinzeni kokusebenza nempilo yonke ye-laser.

Phakathi kwamasu ahlukahlukene okuphatha okushisayo, Ukupholisa Kokuqhutshwa Kokuthintana kugqama njengenye yezindlela ezibaluleke kakhulu nezamukelwa kabanzi ekufakweni kwebha ye-laser diode, ngenxa yesakhiwo sayo esilula kanye nokuhamba kahle kokushisa okuphezulu. Lesi sihloko sihlola izimiso, ukucatshangelwa kwedizayini okubalulekile, ukukhetha kwezinto ezibonakalayo, namathrendi esikhathi esizayo ale "ndlela ezolile" yokulawula ukushisa.

1. Izimiso Zokupholisa Kokuqhutshwa Kokuxhumana

Njengoba igama liphakamisa, ukupholisa kokwenziwa kokuxhumana kusebenza ngokusungula ukuthintana okuqondile phakathi kwe-laser chip kanye nesinki sokushisa, okuvumela ukudluliswa kokushisa okusebenzayo ngezinto zokuguquguquka okuphezulu kwe-thermal kanye nokuhlakazeka okusheshayo endaweni yangaphandle.

①The HdlaPathi:

Kubha ye-laser diode ejwayelekile, indlela yokushisa imi kanje:
I-Chip → Isendlalelo Sokushisa → Intaba Ephansi (isb., ikhopha noma i-ceramic) → I-TEC (I-Thermoelectric Cooler) noma I-Heat Sink → Indawo Ezungezile

②Izici:

Le ndlela yokupholisa ihlanganisa:

Ukugeleza kokushisa okugxilile kanye nendlela emfushane yokushisa, kunciphisa ngokuphumelelayo izinga lokushisa lokuhlangana; Umklamo ohlangene, ofanele ukupakishwa okuncane; Ukuqhutshwa kwe-passive, okungadingi izihibe zokupholisa eziyinkimbinkimbi.

2. Ukucatshangelwa Okubalulekile Kwedizayini Yokusebenza Okushisayo

Ukuqinisekisa ukupholisa kokuqhutshwa kokuxhumana okusebenzayo, izici ezilandelayo kufanele zibhekwe ngokucophelela phakathi nomklamo wedivayisi:

① Ukumelana Nokushisa Ku-Solder Interface

I-conductivity yokushisa ye-solder layer idlala indima ebalulekile ekuphikiseni okuphelele kokushisa. Izinsimbi ze-high-conductivity ezifana ne-AuSn alloy noma i-indium ehlanzekile kufanele zisetshenziswe, futhi ugqinsi lwe-solder layer kanye nokufana kufanele kulawulwe ukuze kuncishiswe izithiyo ezishisayo.

② Ukukhethwa Kwezinto Ezingaphansi

Izinto ezivamile ezingaphansi zihlanganisa:

I-Copper (Cu): I-conductivity ephezulu yokushisa, engabizi kakhulu;

I-Tungsten Copper (WCu)/Molybdenum Copper (MoCu): Umdlalo ongcono we-CTE nama-chips, onikeza kokubili amandla kanye nokusebenza;

I-Aluminium Nitride (AlN): I-insulation kagesi enhle kakhulu, ifanele ukusetshenziswa kwamandla kagesi aphezulu.

③ Ikhwalithi Yokuxhumana Nobuso

Ubulukhuni bobuso, ukucaba, nokubamanzi kuthinta ngokuqondile ukusebenza kahle kokudlulisa ukushisa. Ukupholisha nokwegolide kuvame ukusetshenziselwa ukuthuthukisa ukusebenza kokuxhumana okushisayo.

④ Ukunciphisa Indlela Yokushisa

Idizayini yesakhiwo kufanele ihlose ukufinyeza indlela eshisayo phakathi kwe-chip nosinki wokushisa. Gwema izendlalelo zezinto ezimaphakathi ezingadingekile ukuze uthuthukise ukusebenza kahle kokuqeda ukushisa.

3. Iziqondiso Zokuthuthukiswa Kwekusasa

Ngomkhuba oqhubekayo obheke ku-miniaturization kanye nokuminyana kwamandla aphezulu, ubuchwepheshe bokupholisa be-conduction buyavela ngalezi zikhombisi-ndlela ezilandelayo:

① Ama-TIM Ahlanganisiwe Wezendlalelo Eziningi

Ukuhlanganisa i-metallic thermal conduction nebhafa eguquguqukayo ukuze kuncishiswe ukumelana nesixhumi esibonakalayo futhi kuthuthukiswe ukuqina kokuhamba ngebhayisikili.

② Ukupakisha Okudidiyelwe Kwesinki Yokushisa

Ukuklama ama-submounts namasinki okushisa njengesakhiwo esisodwa esihlanganisiwe sokunciphisa ukuxhumana nokuxhumana nokwandisa ukusebenza kahle kokudlulisa ukushisa kwezinga lesistimu.

③ Ukuthuthukiswa Kwesakhiwo Se-Bionic

Ukusebenzisa izindawo ezinesakhiwo esincane ezilingisa izindlela zemvelo zokuqeda ukushisa—njengokuthi “i-conduction efana nesihlahla” noma “amaphethini afana nesikali”—ukuze kuthuthukiswe ukusebenza kokushisa.

④ Ukulawula Okushisayo Okuhlakaniphile

Ihlanganisa izinzwa zokushisa nokulawula amandla aguqukayo okulawula ukushisa okuguquguqukayo, okunweba ukuphila kokusebenza kwedivayisi.

4. Isiphetho

Kumabha we-laser diode enamandla amakhulu, ukuphatha okushisayo akuyona nje inselele yobuchwepheshe—kuyisisekelo esibalulekile sokwethembeka. Ukupholisa kokwenziwa kothintana naye, okunezici zakhona eziphumelelayo, ezivuthiwe, nezingabizi kakhulu, kuseyisixazululo esivamile sokuqeda ukushisa namuhla.

5. Mayelana Nathi

E-Lumispot, siletha ubuchwepheshe obujulile ekufakweni kwe-laser diode, ukuhlolwa kokuphathwa okushisayo, nokukhetha izinto ezibonakalayo. Umgomo wethu ukuhlinzeka ngezixazululo ze-laser ezisebenza kahle kakhulu, zesikhathi eside ezihambisana nezidingo zakho zohlelo lokusebenza. Uma ungathanda ukufunda okwengeziwe, sikwamukela ngokufudumele ukuze uxhumane nethimba lethu.