Izinto Zokusebenza Zezinsimbi Ze-Laser Diode: Ibhuloho Elibalulekile Phakathi Kokusebenza Nokuthembeka

Ekwakheni nasekukhiqizeni ama-laser we-semiconductor enamandla amakhulu, amabha e-laser diode asebenza njengamayunithi ayinhloko akhipha ukukhanya. Ukusebenza kwawo akuxhomekile kuphela kwikhwalithi yangaphakathi yama-laser chips kodwa futhi kakhulu nenqubo yokupakisha. Phakathi kwezingxenye ezihlukahlukene ezihilelekile ekufakweni, izinto ze-solder zidlala indima ebalulekile njengesikhombimsebenzisi esishisayo nesigesi phakathi kwe-chip nosinki wokushisa.

1. Indima Ye-Solder Kumabha E-Laser Diode

Amabha e-laser diode ngokuvamile ahlanganisa ama-emitter amaningi, okuholela ekuminyaneni okukhulu kwamandla kanye nezidingo eziqinile zokulawula ukushisa. Ukuze kuzuzwe ukushabalaliswa kokushisa okuphumelelayo nokuzinza kwesakhiwo, izinto ze-solder kufanele zihlangabezane nalezi zindlela ezilandelayo:

① Ukusebenza okuphezulu kwe-thermal:

Iqinisekisa ukudluliswa kokushisa okusebenzayo kusuka ku-laser chip.

② Ukubamanzi okuhle:

Inikeza ukuhlangana okuqinile phakathi kwe-chip ne-substrate.

③ Iphoyinti elincibilikayo elifanelekile:

Ivimbela ukugeleza kabusha noma ukuwohloka phakathi nokucubungula noma ukusebenza okulandelayo.

④ I-coefficient ehambisanayo yokwanda kwe-thermal (CTE):

Yehlisa ingcindezi yokushisa ku-chip.

⑤ Ukumelana nokukhathala okuhle kakhulu:

Yelula impilo yesevisi yedivayisi.

2. Izinhlobo ezivamile ze-Solder ye-Laser Bar Packaging

Okulandelayo yizinhlobo ezintathu eziyinhloko zezinto ze-solder ezivame ukusetshenziswa ekufakweni kwe-laser diode bar:

①I-Gold-Tin Alloy (AuSn)

Izakhiwo:

Ukwakheka kwe-Eutectic kwe-80Au/20Sn enephuzu lokuncibilika elingu-280°C; high conductivity ezishisayo namandla mechanical.

Izinzuzo:

Ukuzinza okuhle kakhulu kwezinga lokushisa eliphezulu, impilo ende yokukhathala eshisayo, engenakho ukungcoliswa kwemvelo, ukwethembeka okuphezulu

Izicelo:

Ibutho lezempi, i-aerospace, kanye nezinhlelo ze-laser zezimboni ezisezingeni eliphezulu.

②I-Pure Indium (Ngaphakathi)

Izakhiwo:

Iphuzu lokuncibilika lika-157°C; ithambile futhi ithambile kakhulu.

Izinzuzo:

Ukusebenza kwebhayisikili okushisayo okuphakeme, ingcindezi ephansi ku-chip, ilungele ukuvikela izakhiwo ezintekenteke, ifanele izidingo ze-bonding yezinga eliphansi lokushisa

Imikhawulo:

Ithambekele ku-oxidation; kudinga umkhathi ongenayo ngesikhathi sokucubungula, amandla aphansi wemishini; ayilungele izinhlelo zokusebenza ezinomthwalo omkhulu

③I-Composite Solder Systems (isb, i-AuSn + In)

Isakhiwo:

Ngokuvamile, i-AuSn isetshenziswa ngaphansi kwe-chip ukuze kunamathiselwe okuqinile, kuyilapho i-In isetshenziswa phezulu ukuze kuthuthukiswe ibhafa yokushisa.

Izinzuzo:

Ihlanganisa ukwethembeka okuphezulu nokukhululeka kwengcindezi, ithuthukisa ukuqina kokupakishwa okuphelele, ivumelanisa kahle nezimo ezihlukahlukene zokusebenza

3. Umthelela Wekhwalithi Yesoda Ekusebenzeni Kwedivayisi

Ukukhethwa kwempahla ye-solder nokulawulwa kwenqubo kuthinta kakhulu ukusebenza kwe-electro-optical kanye nokuzinza kwesikhathi eside kwamadivayisi we-laser:

Ngaphansi kokusebenza okuqhubekayo kwamandla aphezulu, ngisho nokukhubazeka okuncane ekufakweni kwe-solder kungaholela ekwakhiweni okushisayo, okuholela ekulimazeni kokusebenza noma ukwehluleka kwedivayisi. Ngakho-ke, ukukhetha i-solder yezinga eliphezulu nokusebenzisa izinqubo zokudambisa ezinembile kubalulekile ekuzuzeni ukupakishwa kwe-laser okunokwethenjelwa okuphezulu.

4. Amathrendi Nentuthuko Yakusasa

Njengoba ubuchwepheshe be-laser buqhubeka nokungena ekucutshungulweni kwezimboni, ukuhlinzwa kwezokwelapha, i-LiDAR, nakweminye imikhakha, izinto zokwakha ze-solder zokupakishwa kwe-laser zivela ngalezi zikhombisi-ndlela ezilandelayo:

①I-solder yezinga lokushisa eliphansi:

Ukuze kuhlanganiswe nezinto ezizwelayo ezishisayo

②Isoda engenamthofu:

Ukuhlangabezana ne-RoHS neminye imithetho yemvelo

③Izinto ezisetshenziswayo ezisebenza kakhulu ezishisayo (i-TIM):

Ukuze uqhubeke nokunciphisa ukumelana nokushisa

④Ubuchwepheshe be-Micro-soldering:

Ukuze kusekelwe miniaturization kanye high-density ukuhlanganiswa

5. Isiphetho

Nakuba kuncane ngevolumu, izinto ze-solder ziyizixhumi ezibalulekile eziqinisekisa ukusebenza nokuthembeka kwamadivayisi we-laser anamandla amakhulu. Ekupakishweni kwemigoqo ye-laser diode, ukukhetha i-solder efanele kanye nokwandisa inqubo yokubopha kubalulekile ukuze kuzuzwe ukusebenza okuzinzile kwesikhathi eside.

6. Mayelana Nathi

I-Lumispot izibophezele ekuhlinzekeni amakhasimende ngezingxenye ze-laser ezinobuchwepheshe nezithembekile nezisombululo zokupakisha. Ngolwazi olubanzi ekukhetheni impahla ye-solder, idizayini yokuphatha okushisayo, nokuhlola ukwethembeka, sikholelwa ukuthi konke ukucwengisiswa ngemininingwane kuvula indlela eya empumelelweni. Ukuze uthole ulwazi olwengeziwe ngobuchwepheshe bokupakisha be-laser obunamandla amakhulu, zizwe ukhululekile ukusithinta.