Umkhiqizo Omusha Wethulwa!Umthombo Wephampu Ye-Diode Laser Solid State Ubuchwepheshe Bakamuva Kwembulwa.

Bhalisela Imidiya Yethu Yezokuxhumana Ukuze Uthumele Ngokushesha

Abstract

Isidingo samamojula we-laser diode-pumped CW (Continuous Wave) sikhula ngokushesha njengomthombo wokumpompa obalulekile wama-laser wesifunda esiqinile.Lawa mamojula anikeza izinzuzo ezihlukile ukuze ahlangabezane nezidingo ezithile ze-solid-state laser application.I-G2 - I-Diode Pump Solid State Laser, umkhiqizo omusha we-CW Diode Pump Series ovela ku-LumiSpot Tech, unenkambu yesicelo ebanzi namandla okusebenza angcono.

Kulesi sihloko, sizofaka okuqukethwe okugxile ekusetshenzisweni komkhiqizo, izici zomkhiqizo, kanye nezinzuzo zomkhiqizo mayelana ne-CW diode pump solid-state laser.Ekupheleni kwesihloko, ngizokhombisa umbiko wokuhlola we-CW DPL ovela eLumispot Tech kanye nezinzuzo zethu ezikhethekile.

 

Inkambu Yesicelo

Ama-laser we-semiconductor enamandla amakhulu asetshenziswa kakhulu njengemithombo yephampu yama-laser esifunda esiqinile.Kuzinhlelo zokusebenza ezingokoqobo, umthombo wokupompa i-semiconductor laser diode ukhiye wokuthuthukisa ubuchwepheshe belaser diode-pumped solid-state laser technology.

Lolu hlobo lwe-laser lisebenzisa i-laser ye-semiconductor enomphumela we-wavelength engashintshi esikhundleni se-Krypton noma i-Xenon Lamp ukuze iphampe amakristalu.Ngenxa yalokho, le laser ethuthukisiwe ibizwa ngokuthi i-2ndukukhiqizwa kwe-CW futha laser (G2-A), enezici zokusebenza kahle kakhulu, impilo ende yesevisi, ikhwalithi enhle ye-boam, ukuzinza okuhle, ukubumbana kanye ne-miniaturization.

Inqubo yabasebenzi abafaka i-DPSS.
Isicelo se-DPL G2-A

·Spacing Telecommunications·I-Environment R&D·I-Micro-nano Processing· Ucwaningo lwe-Atmospheric·Izisetshenziswa Zokwelapha·Ukucutshungulwa kwesithombe

Ikhono Elinamandla Lokumpompa

Umthombo Wephampu we-CW Diode unikeza ukuqhuma okukhulu kwezinga lamandla okubona, ukumpompa ngendlela ephumelelayo inzuzo ye-laser yesimo esiqinile, ukuze kubonwe ukusebenza okungcono kakhulu kwe-solid-state laser.Futhi, amandla ayo aphezulu kakhulu (noma amandla amaphakathi) anika amandla uhla olubanzi lwezinhlelo zokusebenzaimboni, imithi, nesayensi.

I-Beam enhle kakhulu nokuzinza

Imojuli ye-CW semiconductor yokumpompa i-laser inekhwalithi evelele yesibani esikhanyayo, esinozinzo ngokuzenzekelayo, okubalulekile ukuze kubonakale ukuphuma kokukhanya okunembe kwelaser okulawulekayo.Amamojula aklanyelwe ukukhiqiza iphrofayili ye-boom echazwe kahle futhi ezinzile, iqinisekisa ukupompa okuthembekile nokungaguquguquki kwe-laser yesimo esiqinile.Lesi sici sihlangabezana ngokuphelele nezidingo zohlelo lokusebenza lwe-laser ekucubunguleni impahla yezimboni, ukusika laser, kanye ne-R&D.

Ukusebenza Kwegagasi Okuqhubekayo

Imodi yokusebenza ye-CW ihlanganisa kokubili ukufaneleka kwe-laser ye-wavelength eqhubekayo kanye ne-Pulsed Laser.Umehluko omkhulu phakathi kwe-CW Laser nePulsed laser ukuphuma kwamandla.CW i-laser, eyaziwa nangokuthi i-laser yegagasi eqhubekayo, inezici zemodi yokusebenza ezinzile kanye nekhono lokuthumela igagasi eliqhubekayo.

Idizayini Encane Nethembekile

I-CW DPL ingahlanganiswa kalula namanjei-solid state laserkuye ngomklamo ohlangene kanye nesakhiwo.Ukwakhiwa kwabo okuqinile kanye nezingxenye zekhwalithi ephezulu ziqinisekisa ukwethembeka kwesikhathi eside, ukunciphisa izindleko zesikhathi sokuphumula nezokugcina, okubaluleke kakhulu ekukhiqizeni izimboni kanye nezinqubo zezokwelapha.

Isidingo Semakethe Sochungechunge lwe-DPL - Amathuba Emakethe Akhulayo

Njengoba isidingo samalaser esifunda esiqinile siqhubeka nokukhula kuzo zonke izimboni ezihlukene, siyanda nesidingo semithombo yokumpompa esebenza kahle njengamamojula e-laser e-CW diode-pumped.Izimboni ezifana nezokukhiqiza, ezokunakekelwa kwempilo, ezokuvikela, kanye nocwaningo lwesayensi zithembele kumalaser wesifunda esiqinile ukuze asetshenziswe ngokunemba.

Ukufingqa, njengomthombo wokupompa we-diode we-solid-state laser, izici zemikhiqizo: amandla okumpompa amandla aphezulu, imodi yokusebenza ye-CW, ikhwalithi enhle kakhulu ye-beam nokuzinza, kanye nomklamo owakhelwe kahle, ukwandisa isidingo semakethe kulezi. amamojula laser.Njengomphakeli, i-Lumispot Tech iphinda ibeke umzamo omkhulu wokuthuthukisa ukusebenza nobuchwepheshe obusetshenziswa ochungechungeni lwe-DPL.

Umdwebo Wobukhulu be-G2-A

Isethi Yenqwaba Yomkhiqizo ye-G2-A DPL Kusuka ku-Lumispot Tech

Isethi ngayinye yemikhiqizo iqukethe amaqembu amathathu amamojula afanayo astakiwe avundlile, iqembu ngalinye lamamojula Avundlile Stacked Array okumpompa amandla angaba ngu-100W@25A, kanye namandla okumpompa ewonke angu-300W@25A.

Indawo ye-G2-A yepompo ye-fluorescence ikhonjiswe ngezansi:

Indawo ye-G2-A yepompo ye-fluorescence ikhonjiswe ngezansi:

Idatha Eyinhloko Yezobuchwepheshe Ye-G2-A Diode Pump Solid State Laser :

I-Ecapsulation Solder ye

Izitaki ze-Diode Laser Bar

I-AuSn Packed

I-Central Wavelength

1064nm

Amandla Okukhiphayo

≥55W

Ukusebenza Kwamanje

≤30 A

I-Voltage esebenzayo

≤24V

Imodi yokusebenza

CW

Ubude be-Cavity

900mm

Isibuko esiphumayo

T = 20%

Amanzi Okushisa

25±3℃

Amandla Ethu Kwezobuchwepheshe

1. I-Transient Thermal Management Technology

Ama-laser wesimo esiqinile se-semiconductor-pumped asetshenziswa kabanzi kuzinhlelo zokusebenza ze-quasi-continuous wave (CW) ezinamandla okukhipha amandla aphezulu kanye nezinhlelo zokusebenza zegagasi eliqhubekayo (CW) ezinokuphuma kwamandla okumaphakathi okuphezulu.Kulawa ma-laser, ukuphakama kukasinki oshisayo kanye nebanga phakathi kwama-chips (okungukuthi, ukujiya kwe-substrate ne-chip) kuthonya kakhulu amandla okukhipha ukushisa omkhiqizo.Ibanga elikhudlwana le-chip-to-chip liphumela ekulahlekeni kokushisa okungcono kodwa kwenyusa ivolumu yomkhiqizo.Ngokuphambene, uma isikhala se-chip sincishiswa, usayizi womkhiqizo uzoncishiswa, kodwa amandla omkhiqizo okukhipha ukushisa angase anganele.Ukusebenzisa ivolumu ehlangene kakhulu ukuze udizayine i-laser yesimo esiqinile se-semiconductor-pumped ehlangabezana nezimfuneko zokukhipha ukushisa kuwumsebenzi onzima ekwakhiweni.

Igrafu Yokulingisa Okushisayo Kwesimo Esiqinile

Ukulingisa kwe-G2-Y Thermal

I-Lumispot Tech isebenzisa indlela ye-elementi elinganiselwe ukuze ilingise nokubala inkambu yokushisa yedivayisi.Inhlanganisela yokudlulisa ukushisa okuqinile ukulingisa kwe-thermal yesimo esiqinile kanye nokulingiswa kwe-thermal lokushisa okumanzi kusetshenziselwa ukulingisa okushisayo.Ezimweni zokusebenza okuqhubekayo, njengoba kukhonjisiwe emfanekisweni ongezansi: umkhiqizo uhlongozwa ukuthi ube nesikhala esilungile se-chip kanye nokuhlelwa ngaphansi kwezimo eziqinile zokulingisa ukushisa okuqinile.Ngaphansi kwalesi sikhala nokwakheka, umkhiqizo unamandla amahle okukhipha ukushisa, izinga lokushisa eliphakeme eliphansi, kanye nesici esihlangene kakhulu.

2.I-AuSn solderinqubo ye-encapsulation

I-Lumispot Tech isebenzisa indlela yokupakisha esebenzisa isolder ye-AnSn esikhundleni se-solder ye-indium evamile ukuze ibhekane nezinkinga ezihlobene nokukhathala okushisayo, ukufuduka kwe-electromigration, kanye nokufuduka kukagesi okushisayo okubangelwa i-indium solder.Ngokwamukela i-AuSn solder, inkampani yethu ihlose ukuthuthukisa ukuthembeka komkhiqizo nokuphila isikhathi eside.Lokhu kushintsha kwenziwa ngesikhathi kuqinisekiswa izikhala ezihlala njalo zezitaki zamabha, okuphinde kube nomthelela ekuthuthukisweni kokuthembeka komkhiqizo nempilo yokuphila.

Kubuchwepheshe bokupakisha be-high-power semiconductor pumped solid-state laser, i-indium (In) metal iye yamukelwa abakhiqizi abaningi bamazwe ngamazwe njengento yokushisela ngenxa yobuhle bayo bendawo encibilikayo ephansi, ingcindezi yokushisela ephansi, ukusebenza kalula, kanye nepulasitiki enhle. deformation kanye nokungena.Kodwa-ke, kuma-lases wesimo esiqinile esipompa ama-semiconductor ngaphansi kwezimo zokusebenza eziqhubekayo, ingcindezi eshintshanayo izodala ukukhathala koqweqwe lwe-indium welding, okuzoholela ekuhlulekeni komkhiqizo.Ikakhulukazi emazingeni okushisa aphezulu naphansi kanye nobubanzi be-pulse ende, izinga lokuhluleka kwe-indium welding lisobala kakhulu.

Ukuqhathaniswa kokuhlolwa okusheshisiwe kwempilo kwama-lasers anamaphakheji e-solder ahlukene

Ukuqhathaniswa kokuhlolwa okusheshisiwe kwempilo kwama-lasers anamaphakheji e-solder ahlukene

Ngemva kwamahora angu-600 okuguga, yonke imikhiqizo ehlanganiswe ne-indium solder iyahluleka;kuyilapho imikhiqizo embozwe ngethayela legolide isebenza amahora angaphezu kuka-2,000 ngaphandle kokushintsha kwamandla;okubonisa izinzuzo AuSn encapsulation.

Ukuze kuthuthukiswe ukuthembeka kwama-laser we-semiconductor enamandla amakhulu kuyilapho kugcinwa ukufana kwezinkomba zokusebenza ezihlukahlukene, i-Lumispot Tech yamukela i-Hard Solder (AuSn) njengohlobo olusha lwezinto zokupakisha.Ukusetshenziswa kwe-coefficient of thermal expansion material ehambisana ne-substrate (i-CTE-Matched Submount), ukukhululwa okuphumelelayo kokucindezeleka okushisayo, isixazululo esihle sezinkinga zobuchwepheshe ezingase zihlangabezane nazo ekulungiseleleni i-solder eqinile.Isimo esidingekayo se-substrate material (submount) ukuze ikwazi ukudayiswa ku-chip ye-semiconductor i-surface metallization.I-Surface metallization ukwakheka kongqimba lwesivimbelo sokusabalalisa kanye nongqimba lokungena kwe-solder ebusweni be-substrate material.

Umdwebo we-Schematic we-electromigration mechanism ye-laser ehlanganiswe ne-indium solder

Umdwebo we-Schematic we-electromigration mechanism ye-laser ehlanganiswe ne-indium solder

Ukuze kuthuthukiswe ukuthembeka kwama-laser we-semiconductor enamandla amakhulu kuyilapho kugcinwa ukufana kwezinkomba zokusebenza ezihlukahlukene, i-Lumispot Tech yamukela i-Hard Solder (AuSn) njengohlobo olusha lwezinto zokupakisha.Ukusetshenziswa kwe-coefficient of thermal expansion material ehambisana ne-substrate (i-CTE-Matched Submount), ukukhululwa okuphumelelayo kokucindezeleka okushisayo, isixazululo esihle sezinkinga zobuchwepheshe ezingase zihlangabezane nazo ekulungiseleleni i-solder eqinile.Isimo esidingekayo se-substrate material (submount) ukuze ikwazi ukudayiswa ku-chip ye-semiconductor i-surface metallization.I-Surface metallization ukwakheka kongqimba lwesivimbelo sokusabalalisa kanye nongqimba lokungena kwe-solder ebusweni be-substrate material.

Inhloso yayo ngakolunye uhlangothi ukuvimba i-solder ekusakazeni kwezinto ezibonakalayo, ngakolunye uhlangothi ukuqinisa i-solder ngekhono le-welding ye-substrate, ukuvimbela ungqimba we-solder we-cavity.I-Surface metallization ingaphinda ivimbele i-substrate material surface oxidation kanye nokungena komswakama, inciphise ukuthintana nokumelana nenqubo yokushisela, ngaleyo ndlela ithuthukise amandla okushisela nokuthembeka komkhiqizo.Ukusetshenziswa kwe-hard solder i-AuSn njengento yokushisela ye-semiconductor pumped solid state lasers kungagwema ngempumelelo ukukhathala kwe-indium, i-oxidation kanye nokufuduka kwe-electro-thermal kanye nokunye ukukhubazeka, ukuthuthukisa ngokuphawulekayo ukwethembeka kwama-lases semiconductor kanye nempilo yesevisi ye-laser.Ukusetshenziswa kobuchwepheshe be-golide-tin encapsulation kunganqoba izinkinga ze-electromigration kanye nokufuduka kwe-electrothermal ye-indium solder.

Isixazululo esivela ku-Lumispot Tech

Kuma-lasers aqhubekayo noma ashaywayo, ukushisa okukhiqizwa ukumuncwa kwemisebe yephampu nge-laser medium kanye nokupholisa kwangaphandle kwe-medium kuholela ekusabalaliseni izinga lokushisa elingalingani ngaphakathi kwendawo ye-laser, okuholela kuma-gradients okushisa, okubangela izinguquko kunkomba ye-refractive ye-medium. bese ikhiqiza imiphumela ehlukahlukene yokushisa.I-thermal deposition ngaphakathi kwendawo yokuthola iholela kumphumela we-lensing eshisayo kanye nomphumela we-thermal-indued birefringence, okhiqiza ukulahlekelwa okuthile ohlelweni lwe-laser, okuthinta ukuzinza kwe-laser emgodini kanye nekhwalithi ye-beam ephumayo.Kusistimu ye-laser eqhubekayo, ukucindezelwa okushisayo ku-medium inzuzo kuyashintsha njengoba amandla epompo ekhula.Imiphumela ehlukahlukene yokushisa ohlelweni ithinta kabi lonke uhlelo lwe-laser ukuthola ikhwalithi engcono ye-beam namandla okukhipha aphezulu, okungenye yezinkinga okufanele zixazululwe.Indlela yokuvimbela ngokuphumelelayo nokunciphisa umphumela oshisayo wamakristalu enkambweni yokusebenza, ososayensi baye bakhathazeka isikhathi eside, sekuye kwaba enye yezindawo zokucwaninga zamanje.

Nd:I-laser ye-YAG ene-thermal lens cavity

Nd:I-laser ye-YAG ene-thermal lens cavity

Kuphrojekthi yokuthuthukisa ama-laser anamandla aphezulu we-LD-pump Nd:YAG, amalaser e-Nd:YAG ane-lensing cavity axazululiwe, ukuze imojula ikwazi ukuthola amandla aphezulu ngenkathi ithola ikhwalithi ephezulu ye-beam.

Kuphrojekthi yokuthuthukisa i-laser enamandla kakhulu ye-LD-pumped Nd:YAG, iLumispot Tech ithuthukise imojuli ye-G2-A, exazulula kakhulu inkinga yamandla aphansi ngenxa yemigodi equkethe amalensi ashisayo, okuvumela imojula ukuthi ithole amandla aphezulu. ngekhwalithi ephezulu ye-beam.


Isikhathi sokuthumela: Jul-24-2023